发明名称 |
Stacked circuit board assembly adapted for heat dissipation |
摘要 |
An apparatus is provided for dissipating heat from a stacked circuit board assembly. The apparatus includes circuit boards that are oriented in spaced planes that extend substantially parallel to one another. A heat transfer means connected to the circuit boards transfers heat between the circuit boards. A heat dissipation means connected to at least one of the circuit boards dissipates at least a portion of the transferred heat.
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申请公布号 |
US5986887(A) |
申请公布日期 |
1999.11.16 |
申请号 |
US19980181448 |
申请日期 |
1998.10.28 |
申请人 |
UNISYS CORPORATION |
发明人 |
SMITH, GRANT M.;TAMARKIN, VLADIMIR K. |
分类号 |
H01L23/36;H01L23/40;H05K1/14;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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