发明名称 Method for forming thin film transistor
摘要 A method for forming a thin film transistor (TFT) is disclosed. The invention uses metal electroless plating or chemical displacement processes to form metal clusters adjacent the sidewall of amorphous silicon active region pattern so as to crystallize the amorphous silicon amid the subsequently performed metal induced lateral crystallization (MILC) process. The amorphous silicon is crystallized to form polysilicon having parallel grains. Since the amorphous silicon will crystallize with a specific angle which is measured between the grain orientation and the side wall of the amorphous silicon, a tilt channel connecting the source and drain region of the TFT is utilized to upgrade the electron mobility across the tilt channel, wherein the grain orientation of polysilicon in the tilt channel perpendicular to a gate electrode which is subsequently formed above the tilt channel.
申请公布号 US6475835(B1) 申请公布日期 2002.11.05
申请号 US20020084329 申请日期 2002.02.28
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 HU GUO-REN;CHEN YING-CHIA;CHAO CHI-WEI;WU YEW-CHUNG;HSU YAO-LUN;DAI YUAN-TUNG;WANG WEN-TUNG
分类号 H01L21/20;H01L21/336;H01L29/786;(IPC1-7):H01L21/84;H01L27/148 主分类号 H01L21/20
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