| 摘要 |
<p>A method of making a microstructure (41, 42, 43, 44) includes the steps of providing a circuit board (1) that includes a dielectric layer (11) and a conductor layer (12) formed on the dielectric layer (11), forming a metal structure (2) on the circuit board (1) such that the metal structure (2) extends through the dielectric layer (11), and removing at least a portion (11") of the dielectric layer (11) adjacent to the conductor layer (12) and the metal structure (2) to result in the microstructure (41, 42, 43, 44). <IMAGE></p> |
