| 摘要 |
<p>A semiconductor device (100) has a first substrate (110) and a second substrate (130). The first substrate (110) has first electrodes (118) on at least one surface. The second substrate (130) has concave portions (132) on a surface, and second electrodes (134) provided on bottom surfaces of the concave portions (132). The semiconductor device (110) further has metallic members (150) located between the first electrodes (118) of the first substrate (110) and the second electrodes (134) of the second substrate (130). The metallic members (150) have a height greater than a depth of the concave portions (132) of the second substrate (130), and electrically and mechanically bond the first electrodes (118) of the first substrate (110) and the second electrodes (134) of the second substrate (130).</p> |
