发明名称 |
PLATED RESIN MOLDING |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a plated resin molding in which a plated layer has high adhesive strength. <P>SOLUTION: In the plated resin molding, a metal-plated layer is formed on the surface of a thermoplastic resin molding made of a composition containing 10-90 mass% of a matrix resin (A) having a water absorption coefficient after 24 h in water of 23°C (ISO 62) of at least 0.6% and 90-10 mass% of a resin (B) excluding a styrene resin having a water absorption coefficient after 24 h in water of 23°C (ISO 62) below 0.6%. The thermoplastic resin molding is not etched with an acid containing a heavy metal. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
申请公布号 |
JP2005231219(A) |
申请公布日期 |
2005.09.02 |
申请号 |
JP20040043925 |
申请日期 |
2004.02.20 |
申请人 |
DAICEL POLYMER LTD;DAICEL CHEM IND LTD |
发明人 |
TAI TOSHIHIRO;KO UTSUKOU;IZUMITANI TATSUO |
分类号 |
B32B15/08;C08L101/00;C23C18/16;C23C18/24;C23C18/28;(IPC1-7):B32B15/08 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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