| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent damaging a circuit element due to the impact energy of bonding and stress in the case of probing when an input/output pad is formed in an I/O cell. <P>SOLUTION: An input/output circuit for a semiconductor integrated circuit is provided with the input/output pad 21 for probing or bonding. The input/output pad 21 has at least one pad on an element area inside of the input/output circuit, and has a via 63 arranged just under a pad of a top layer. This absorbs damage to a wiring part and a spreading part caused by bonding load like a wire bond, reduces influence of ultrasonic waves in the case of ball bonding, and absorbs stress and impact energy applied to a film between pad lower layers in the case of probing. This relaxes stress applied to the wiring part and a spreading element just under the pads, so that connection is carried out easily without occurrence of the damage. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
