| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a reticle for accurately specifying a desired position of a pattern on measuring length, and a method for manufacturing a semiconductor device. <P>SOLUTION: Dicing lines 12 in longitudinal and lateral directions and chip regions surrounded by the dicing lines 12 are formed on a resist film. A pair of length measurement patterns is formed in the dicing line 12 to interpose the center line between the patterns. On measuring length of the resist film having the above pattern formed thereon by using a CD-SEM (critical dimension scanning electron microscope), first an objective chip region 11a for length measurement is designated among a plurality of chip regions, and the position of the length measurement pattern 13a placed in the left side is identified. Then the distance between two liner portions constituting the length measurement pattern 13a is measured. During measuring, the distance of a measurement portion 14 in the side near the objective chip region 11a from the center line of the dicing line 12 is measured. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
