发明名称 EXPOSURE DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide an exposure device capable of exposing a wafer in which intervals of lines to be partitioned are different without manufacturing any mask member each time. <P>SOLUTION: The exposure device exposes along the lines to be partitioned resist films coated on the rear face or the front surface of the wafer on which a functional element is formed in a region divided by lattice like lines to be partitioned on the front surface thereof. The device includes a zipper table 3 for holding the wafer; alignment means 5 for detecting the lines to be partitioned formed on the wafer held by the zipper table 3; slit exposure means 6 for exposing a slit light corresponding to the lines to be partitioned on the resist films coated on the rear face or the front surface of the wafer held by the zipper table 3; and index means for relatively moving the zipper table 3 and the slit exposure means 6, and positioning the lines to be partitioned formed on the wafer held by the zipper table 3 at an exposure position of the slit light. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006156859(A) 申请公布日期 2006.06.15
申请号 JP20040348051 申请日期 2004.12.01
申请人 DISCO ABRASIVE SYST LTD 发明人 SEKIYA KAZUMA;ONO TAKASHI
分类号 H01L21/027;G03F7/20;G03F9/00;H01L21/301 主分类号 H01L21/027
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