| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting diode package excellent in bonding strength, in which the electric short circuit of semiconductor layers is prevented. <P>SOLUTION: The light-emitting diode package includes a package substrate, a light emitting diode chip joined to the upper surface of the package substrate, and a bonding member which bonds the light emitting diode chip to the package substrate. A bonding groove part housing the bonding member is formed in the bonding surface of the package substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT |
