CAPACITOR, CHIP CARRIER TYPE CAPACITOR, SEMICONDUCTOR DEVICE, MOUNTING SUBSTRATE, AND PROCESS FOR FABRICATING CAPACITOR

摘要

PROBLEM TO BE SOLVED: To provide a capacitor in which high frequency characteristics are improved more.

SOLUTION: The capacitor comprises first and second square pads, a first electrode provided with an opening for passing a second via and connected with the first pad through a first via, a second electrode provided with an opening for passing first and second vias for every via and connected with the second pad through a third via, and a dielectric disposed between the first and second electrodes and provided with an opening for passing first and second vias for every via. The second via is connected at the center of the second pad, and the third via is connected with the second pad between the center and the vertex thereof.

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