| 摘要 |
PROBLEM TO BE SOLVED: To provide a production method for electronic circuit device which can automate the processing for removing a deformed portion from the surface of a casing on the side exposing a circuit board, and to provide an electronic circuit device formed by this production process. SOLUTION: While a circuit board 2, having a thickness which is set thick beforehand in the cavity of a die, is held, a casing 4 is molded, such that the surface of the circuit board 2 on the side exposing the non-mounting surface 22 projects entirely from the surface that serves as the external surface of an end product thus obtaining an intermediate product of an electronic key transceiver 1A. Thereafter, the surface of the casing 4 on the side; exposing the non-mounting surface 22 of the circuit board 2, is shaven off over entirely, up to the external surface of the end product thus obtaining an electronic key transceiver 1. COPYRIGHT: (C)2009,JPO&INPIT
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