| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealing device capable of improving production efficiency. SOLUTION: The device includes a substrate stage 2A that holds a substrate KA substantially horizontally, an imaging camera 4a that captures an image of an on-board chip mounted on the substrate, a camera drive part 5a that drives the imaging camera substantially in the horizontal direction, a dispenser 6a comprising a resin discharge nozzle 61a that applies a sealing resin to the on-board chip, a dispenser drive part 7a that drives the dispenser substantially in the horizontal and vertical directions, and a controller 9 that controls the dispenser drive part based on the positional information of the on-board chip C acquired by the imaging camera capturing the image of the on-board chip so that the position at which resin is discharged to the on-board chip by the resin discharge nozzle is appropriate, wherein the controller is configured so as to control the operations of the camera drive part and the dispenser drive part so that the operation to capture the image of a first on-board chip CB8 by the imaging camera and the operation to apply resin to a second on-board chip CA6 by the dispenser are performed simultaneously. COPYRIGHT: (C)2009,JPO&INPIT
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