| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate holder mechanism which can conduct surface grinding for an ultrathin semiconductor substrate of 20-50μm, without causing chippings or crackings. SOLUTION: A semiconductor substrate 3 is placed on the upper surface of a disc-like semiconductor substrate holder table 4, with an annular bank 40 at its outer circumferential edge in a substrate holder mechanism with dresser, and a turning cup wheel-type grinding stone 50 is lowered to the rotating semiconductor substrate 3 so as to notch and grind it. Since the annular bank 40 holds the lower surface of the edge of the semiconductor substrate, chipping will not occur at the edges of the semiconductor substrate, even if the grinding stone shaft is inclined at the edge thereof. In addition, the pressing force of a spring 82 of the height-adjusting mechanism works upward on the bottom of an annular dresser grinding stone 6, so that the grinding surface of the semiconductor substrate and the upper surface of the annular dresser grinding stone can be kept on the same surface, when the semiconductor substrate is ground. COPYRIGHT: (C)2009,JPO&INPIT
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