Shielded wire arrangement for die testing

摘要

An integrated circuit includes a die having a conductive layer. The conductive layer includes a data wire, a first power supply wire of a first voltage potential, and a second power supply wire of a second voltage potential different from the first voltage potential. A segment of the data wire is located between, and substantially parallel to, a segment of the first power supply wire and a segment of the second power supply wire. Further, the first power supply wire is coupled to a first probe structure; and, the second power supply wire is coupled to a second probe structure.

主权项

1. An integrated circuit, comprising:
a passive die comprising a conductive layer; wherein the conductive layer comprises a data wire, a first power supply wire of a first voltage potential, and a second power supply wire of a second voltage potential different from the first voltage potential; wherein a segment of the data wire is located between, and substantially parallel to, a segment of the first power supply wire and a segment of the second power supply wire; wherein the first power supply wire is coupled to a first probe structure and the second power supply wire is coupled to a second probe structure; wherein the passive die is configured as a common mounting surface for a plurality of dies and to electrically couple the plurality of dies using the first power supply wire, the second power supply wire, and the data wire; and wherein the passive die is configured for detecting short circuits between the first power supply wire, the second power supply wire, and the data wire.