Method and hardware for cleaning UV chambers

摘要

A cleaning method for a UV chamber involves providing a first cleaning gas, a second cleaning gas, and a purge gas to one or more openings in the chamber. The first cleaning gas may be an oxygen containing gas, such as ozone, to remove carbon residues. The second cleaning gas may be a remote plasma of NF3 and O2 to remove silicon residues. The UV chamber may have two UV transparent showerheads, which together with a UV window in the chamber lid, define a gas volume proximate the UV window and a distribution volume below the gas volume. A purge gas may be flowed through the gas volume while one or more of the cleaning gases is flowed into the distribution volume to prevent the cleaning gases from impinging on the UV transparent window.

主权项

1. A method of cleaning a process chamber having an interior space, comprising:
providing a purge gas to a first portion of the interior space; providing a first cleaning gas to a second portion of the interior space, wherein the first portion of the interior space is separated from the second portion of the interior space by a first UV transparent showerhead; activating the first cleaning gas using ultraviolet (UV) radiation from UV lamps positioned outside the process chamber; providing a second cleaning gas to the second portion of the interior space, wherein the second cleaning gas is provided to the second portion of the interior space through a flow channel that allows gas to enter the second portion of the interior space without first flowing through the first portion of the interior space; flowing the first and second cleaning gases through a second UV transparent showerhead that separates the second portion of the interior space from a third portion of the interior space such that the first and second cleaning gases can remove contaminant material from surfaces of the process chamber; and exhausting the purge gas, the first cleaning gas, and the second cleaning gas through a side wall of the chamber.