| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve manufacturing yield and reliability, etc. of semiconductor devices, by controlling voids generated between a substrate and semiconductor elements and among a plurality of semiconductor elements. <P>SOLUTION: A substrate 2, having an element-mounting part 2a is provided to attract a region, except for the element mounting part 2a, and is arranged on an attracting stage 21 including attraction holes with a diameter of 0.5 mm or larger, and of 1.0 mm or smaller. A first semiconductor element 5 is sucked with a suction rubber collet 22, having a Shore A hardness of 50 or larger and 70 or smaller, and is then bonded to the element mounting part 2a of the substrate 2 attracted and held by the suction stage 21. Then, a second semiconductor element on which a second adhesive layer, including a remaining volatile matter 0.2% or lower, is arranged on a first semiconductor element, and the second adhesive layer is adhered through the heating process in the temperature range of 120°C or higher, and of 150°C or lower. <P>COPYRIGHT: (C)2007,JPO&INPIT |
