TRAEGERSUBSTRAT UND VERFAHREN ZUR HERSTELLUNG DES TRAEGERSUBSTRATES

摘要

A carrier substrate comprises an insulator base (6) with terminals (10-13) for external connection and a wiring portion (4) provided on the insulator base for connecting circuit elements to be mounted on the base to the terminals for external connection. The wiring portion includes a plurality of insulating films (9a, 9b, 9c), an electrode layer provided on the uppermost insulating layer (3a) for connection with the circuit elements, and conductors (5a) provided on the other insulating layers for connecting the electrode layer to the terminals for external connection. A circuit element (1) layer may further be provided on an insulating layer other than the uppermost insulating layer. The circuit element layer has circuit elements formed in a thin film. Alternatively or in addition to the circuit element layer, a wiring layer may further be provided. <IMAGE>