| 发明名称 |
Signal isolation in a package substrate |
| 摘要 |
Signal traces are patterned on a top surface of a substrate. A ground trace is patterned on the top surface of the substrate for at least one pair of the signal traces. A die paddle is patterned on the top surface of the substrate, and the die paddle is connected directly with the ground trace.
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| 申请公布号 |
US7250673(B2) |
申请公布日期 |
2007.07.31 |
| 申请号 |
US20050146817 |
申请日期 |
2005.06.06 |
| 申请人 |
TRIQUINT SEMICONDUCTOR, INC. |
发明人 |
MANGOLD TOBIAS |
| 分类号 |
H01L23/48;H01L23/12;H01L23/495;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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