| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent chipping or cracking or the like from generating during dicing. <P>SOLUTION: A light-emitting diode array manufacturing method is the method for manufacturing a light-emitting diode array 10 by dicing a semiconductor wafer 12 with light-emitting diode array chips 15 formed thereon, where a plurality of light-emitting dots 11 composed of a light-emitting diode are arrayed at a dicing guide groove 13, etc., between the adjacent light-emitting diode array chips. A side edge 18 arranged inside the dicing guide groove 13 in a glass film 17, which is attached to the light-emitting diode array chip 15 so as to protect the array chip, is diced along the outer side of a negative tolerance mark 20A, which is provided with respect to a dicing target line 16 assumed in the dicing guide groove 13. <P>COPYRIGHT: (C)2007,JPO&INPIT |
