发明名称 Electronic part unit or assembly having a plurality of electronic parts enclosed within a metal enclosure member mounted on a wiring layer
摘要 An electronic part unit which is superior in heat radiation and airtightness. The electronic part unit comprises a unit circuit board having a wiring pattern formed on a surface thereof, an electronic part mounted on the wiring pattern of the unit circuit board, a resin enclosure member for covering over a surface of the wiring pattern of the unit circuit board with the electronic part partially exposed outside, and a metal enclosure member for covering over the exposed portion of the electronic part, a surface of the resin enclosure member and the unit circuit board. The unit circuit board has a metal pad formed integrally over the entire periphery on the surface in the proximity of the outer periphery thereof, and the metal enclosure member is joined integrally to the metal pad.
申请公布号 US5510956(A) 申请公布日期 1996.04.23
申请号 US19940277205 申请日期 1994.07.19
申请人 FUJITSU LIMITED 发明人 SUZUKI, MASAKAZU
分类号 H05K3/28;H01L21/56;H01L23/31;H01L23/34;H01L23/367;H01L23/373;H01L25/04;H01L25/18;H05K1/02;H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K3/28
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