| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor laser device, its manufacturing method, and an optical pickup device, capable of miniaturization and suppress of life shortening caused by the generation of heat of the semiconductor laser chip, as well as capable of improving productivity and firm attachment of a cap without complicating a process. <P>SOLUTION: Since both a base 23 and a cap 24 are formed of a synthetic resin, they can be fixed firmly when they are formed integrally by ultrasonic fusion. Furthermore, since they can be joined in short time, productivity can be improved. Since a lead 22a for chip mounting is mounted on one front surface 41 of the electrode lead 22a for chip mounting which has a heat dissipation region 42 for heat dissipation around this semiconductor laser chip 21, the heat of the semiconductor laser chip 21 is dissipated to the lead 22a for chip mounting. By dissipating the heat from the heat dissipation region 42, the temperature rise of the semiconductor laser chip 21 is controlled, and thus, the life shortening of the semiconductor laser chip 21 can be suppressed. <P>COPYRIGHT: (C)2007,JPO&INPIT |
