| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device wherein its bonding wires contact hardly with each other. <P>SOLUTION: In the semiconductor device, memory chips 2-5 are laminated on the surface of a wiring substrate 1, and a micro-computer chip 6 and an interposer chip 7 are disposed on the surface of the memory chip 5. Further, pads 16, 17 of the micro-computer chip 6 and pads 18, 19 of the interposer chip 7 which are disposed in the arcuate form are connected by bonding wires W2, W3. Therefore, since the injecting pressure of a liquid resin for sealing can be weakened by the wires W2, the wires W3 can be prevented from contacting with each other due to the deformations of the wires W3. <P>COPYRIGHT: (C)2007,JPO&INPIT |
