| 摘要 |
A laminating device of a flexible printed circuit board and a method thereof are provided to freely adjust a pre-heated section according to a thickness and a material of a copper film and upper and lower dry films by adjusting incident angles of the copper film and the upper and the lower dry films. A copper film(4) from a copper film providing roller is contacted with a first lower heat adhering roller(7) and is pre-heated by providing the copper film(4) from a lower part through a first lower incident angle adjustment roller(6). An upper dry film(11) is provided to have an adjusted incident angle from an upper part through an upper incident angle adjustment roller(12) which adjusts a height. An upper plane laminating unit(2) penetrates with the copper film(4) between the upper heat adhering roller(15) and the first lower heat adhering roller(7) and is laminated on an upper plane of the copper film(4). A laminated copper film(18) is provided to have an adjusted incident angle from an upper part through a second upper incident angle adjustment roller(22) which adjusts a height. The laminated copper film(18) is contacted with a heat adhering roller(23) and is pre-heated. A lower dry film(20) from a lower film providing roller(24) is provided to have an adjusted incident angle from a lower part through a second lower incident angle adjustment roller(25) when removing a cover film. A lower plane laminating unit(19) passes with the upper laminated copper(18) between the second lower heat adhering roller(26) and the second upper heat adhering roller(23) which is contacted with the second lower heat adhering roller(26) and is pre-heated. The lower plane laminating unit(19) is laminated on a lower plane of the copper film(4).
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