发明名称 HIGH FREQUENCY CIRCUIT APPARATUS, HIGH FREQUENCY MODULE, AND WIRELESS COMMUNICATION APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a high frequency circuit apparatus, a high frequency module, and a wireless communication apparatus for reducing the power loss, improving a circuit operation characteristic, and preventing abnormity oscillation by attenuating a PPM leaky wave propagated in a board. <P>SOLUTION: The high frequency circuit apparatus includes slot lines 1, 2 and a FET 200 which are located on a front side of a dielectric board 100, and slot lines 3, 4 configuring a PDTL asymmetric to the slot lines 1, 2 and which are located on a rear side of the dielectric board 100. Grounded conductor plates 5-1, 5-2 are fitted to both sides of the dielectric board 100, an upper side 52 of the conductor plate 5-1(5-2) is in contact with a front side conductor 101 and a lower side 53 is in contact with a rear side conductor 102 respectively, so as to short-circuit the front side conductor 101 and the rear side conductor 102 by the conductor plate 5-1(5-2). Further, an air gap 55 is demarcated between a board end 100a (100b) of the dielectric board 100 and an upright part 51 of the conductor plate 5-1(5-2) to open the board end 100a (100b). <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008028483(A) 申请公布日期 2008.02.07
申请号 JP20060196250 申请日期 2006.07.18
申请人 MURATA MFG CO LTD 发明人 EJIMA KAZUKI;NAKAJIMA MASAYUKI;TAGO SHIGERU
分类号 H03F3/60;H01L23/12;H01P5/10 主分类号 H03F3/60
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