发明名称 PARTITIONING MATERIAL AND HEATING/COOLING SYSTEM
摘要 <P>PROBLEM TO BE SOLVED: To provide a partitioning material improved in thermal conductivity to be suitable for radiation heating/cooling, and a heating/cooling system utilizing the partitioning material. <P>SOLUTION: This partitioning material 20 is used for partitioning rooms R in a building, and comprises a plate-shaped main body 21, and a heat conductive member 23 buried in the main body 21 and composed of a material having thermal conductivity higher than that of the main body 21. The heat conductive material 23 includes a burying portion 24 penetrating through a room R side and a back face 21r disposed at an opposite side, of the main body 21, and an expansion portion 25 expanding on the back face 21r. The heating/cooling system comprises the partitioning material 20 and a nozzle 10 for supplying the temperature-conditioned air g along a face at a back side of the partitioning material 20. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008309398(A) 申请公布日期 2008.12.25
申请号 JP20070157380 申请日期 2007.06.14
申请人 ECO POWER:KK;SANYO KOGYO TOHOKU SYSTEM:KK 发明人 TSUNODA TADASHI;KIKUCHI MASAYOSHI;KOYAMA SATONORI
分类号 F24F5/00 主分类号 F24F5/00
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