METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, FILM-LIKE CURABLE RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide: a method for manufacturing an electronic component, which is superior in the production efficiency of electronic components; and a film-like curable resin composition for sealing an optical semiconductor device, which can be used therefor, and which can be cured in a short time.SOLUTION: A method for manufacturing an electronic component comprises the steps of: sticking a film-like curable resin composition to a face of a device member having a substrate and an optical semiconductor device provided on the substrate on the side of the optical semiconductor device so that the optical semiconductor device is located inward from an outer edge of the film-like curable resin composition; and curing the film-like curable resin composition thus stuck, thereby forming a cured product of the film-like curable resin composition as an encapsulation member for encapsulating the optical semiconductor device. The film-like curable resin composition includes (A) an acrylic polymer, (B) an acrylic monomer and (C) a polymerization initiator.SELECTED DRAWING: Figure 1