发明名称 |
Wafer-level lens systems and methods for manufacturing the same |
摘要 |
A wafer-level lens system includes one or more wafer-level lenses, each of the one or more wafer-level lenses having a substrate with opposing first and second surfaces, a first lens element of a first material and disposed on the first surface, and a second lens element of a second material and disposed on the second surface, wherein, for at least one of the one or more wafer-level lenses, the first material is different from the second material. Another wafer-level lens system includes three wafer-level lenses optically coupled in series with each other, each of the three wafer-level lenses having a substrate with opposing first and second surfaces, a first lens element disposed on the first surface and having an aspheric surface facing away from the first surface, and a second lens element disposed on the second surface and having an aspheric surface facing away from the second surface. |
申请公布号 |
US9366848(B2) |
申请公布日期 |
2016.06.14 |
申请号 |
US201414323846 |
申请日期 |
2014.07.03 |
申请人 |
OmniVision Technologies, Inc. |
发明人 |
Yin Chuen-Yi;Deng Jau-Jan |
分类号 |
G02B13/18;G02B3/08;G02B9/00;G02B13/00;G02B9/12;B29D11/00 |
主分类号 |
G02B13/18 |
代理机构 |
Lathrop & Gage LLP |
代理人 |
Lathrop & Gage LLP |
主权项 |
1. A wafer-level lens system for imaging a scene onto an image plane, comprising:
three wafer-level lenses optically coupled in series with each other, each of the wafer-level lenses including:
a substrate, having opposing first and second surfaces,a first lens element of a first material and disposed on the first surface, anda second lens element of a second material and disposed on the second surface;wherein, for at least one of the wafer-level lenses, the first material is different from the second material, and wherein the wafer-level lens system has F-number less than 2.5. |
地址 |
Santa Clara CA US |