METHOD FOR FILLING THROUGH HOLE BY ELECTROPLATING

摘要

A method for filling a through hole by electroplating. The method comprises the following steps: 1) using an electroplating device; 2) connecting a to-be-electroplated piece that has a through hole to the negative electrode of a power source, and placing the piece into an electroplating solution in an electroplating bath; 3) controlling the power source to work according to a control condition, and continuously electroplating the piece for T time, wherein T>0, the control condition is that: within an initial stage T1 period, a current density J1 of the to-be-electroplated piece ranges from 2 ASD to 3 ASD, and 30%≤T1/T≤50%; in a mid-term stage T2 period, a current density J2 of the to-be-electroplated piece ranges from 0.5 ASD to 1.5 ASD, and 20%≤T2/T≤40%; and in a terminal stage T3 period, a current density J3 of the to-be-electroplated piece ranges from 1.0 ASD to 2.0 ASD, T3=T-T1-T2，and J1>J3>J2. The method can relatively reduce time used for filling a through hole and helps to improve the production efficiency.