发明名称 COMBINED AUDIO JACK AND MOBILE ELECTRONIC DEVICE ENCLOSURE
摘要 Enclosures for electronic devices are provided. These enclosures can be integrally formed with a full or partial receptacle connector shell for receiving electrical connectors such as audio connectors or plugs. For example, an enclosure made from a polymer can be integrally formed with an audio jack shell in an injection molding process. As another example, an enclosure can be integrally formed with one or more full or partial walls of an audio jack shell to form a single piece of polymer or metal and the remaining walls of the audio jack shell can be overmolded or assembled to the polymer or metal walls of the audio jack and proximate portions of the enclosure to form a full or complete audio jack shell.
申请公布号 US2016204558(A1) 申请公布日期 2016.07.14
申请号 US201615079777 申请日期 2016.03.24
申请人 APPLE INC. 发明人 Woodhull Charles B.;Sloey Jason S.
分类号 H01R24/58;H01R13/50 主分类号 H01R24/58
代理机构 代理人
主权项 1. A receptacle connector shell integrally formed within an electronic device enclosure, the electronic device enclosure comprising: a unibody structure having a back portion including front and back surfaces, a bottom wall extending along a bottom edge of the back portion, and an opening formed within the bottom wall and arranged to be in communication with a cavity, the opening being sized and shaped to receive a plug connector such that the plug connector can be inserted through the opening and into the cavity; and one or more connector shell walls integrally formed with the back portion and the bottom wall to at least partially define the cavity.
地址 Cuptertino CA US