PREPARATION METHODS OF METALLIC FILMS OR PATTERNS USING LOW TEMPERATURE SINTERING OF CARBON-COATED COPPER NANOPARTICLE

摘要

The present invention relates to a method of producing a high-conductive metal film or metal pattern using a double low-temperature tempering method using a carbon-coated copper nanoparticle. The low-tempering process of the present invention is composed of two processes of oxidizing and reducing and, more specifically, an oxidization process for 5-30 minutes and a reduction process for 5-30 minutes. The metal film or pattern of the present invention produced by the double low-temperature tempering method obtains a low electric resistance value through a neck formation and a growth of the copper nanoparticle; thereby obtaining high-conductive properties. Accordingly, the high-conductive metal film or pattern is able to be formed on a substrate, specifically, a flexible substrate using a copper nanoparticle ink/paste. In addition, the high-conductive metal film or metal pattern obtains electrical properties much better than a polymer substance used in the past; thereby being usefully applied to industries.