Polishing coated substrates

摘要

A process for the production of an optoelectronic device, such as a photovoltaic cell or a light emitting diode is disclosed. The process comprises providing a substrate having a conductive coating on at least one surface, the conductive coating having an initial roughness and at least one or more spikes, and applying a functional component to the coated surface of the substrate. The surface of the substrate having the conductive coating has been subjected to a polishing step using at least one brush to reduce the height of the spikes inherent to the conductive coating and to give the conductive coating a final roughness. By reducing the spikes there is less potential for the optoelectronic device to suffer from electrical shunts which reduce the efficiency of the device.

主权项

1. A process of producing an optoelectronic device, the process comprising the steps of:
a) providing a glass substrate; b) applying on at least one surface of the glass substrate a transparent conductive oxide, the transparent conductive oxide forming a coating having an exposed surface with an initial roughness and at least one or more spikes inherent to the exposed surface of the transparent conductive oxide coating; c) polishing the exposed surface of the transparent conductive oxide coating using at least one brush to reduce the height of the at least one or more spikes inherent to the exposed surface of the transparent conductive oxide coating to produce a polished transparent conductive oxide coating with a final roughness; d) following step c), applying a functional component to the polished surface of the transparent conductive oxide coating.