Electronic device and method for fabricating an electronic device

摘要

An embodiment electronic device comprises a semiconductor chip including a first main face, a second main face and side faces each connecting the first main face to the second main face. A metal layer is disposed above the second main face and the side faces, the metal layer including a porous structure.

主权项

1. An electronic device comprising:
a semiconductor chip comprising a first main face, a second main face, and side faces each connecting the first main face to the second main face; an interdiffusion prevention layer directly disposed on the second main face and the side faces, wherein the interdiffusion prevention layer comprises a single Ti layer or a layer stack comprising two or more layers of Ti and a Ti alloy; and a metal layer directly disposed on the interdiffusion prevention layer, wherein the metal layer comprises an upper horizontal portion disposed above the second main face, a vertical portion disposed above the side faces, and a lower horizontal portion extending in a plane of the first main face, and wherein the lower horizontal portion is shaped in a form of a closed ring surrounding the semiconductor chip, wherein the metal layer is a porous metal layer.