Chip package having extended depression for electrical connection and method of manufacturing the same

摘要

A semiconductor package includes a semiconductor chip, a first and a second depression, a first and second redistribution layer and a packaging layer. The semiconductor chip has an electronic component and a conductive pad that are electrically connected and disposed on an upper surface of the semiconductor chip. The first depression and first redistribution layer extend from the upper surface toward the lower surface of the semiconductor chip. The first redistribution layer and the conductive pad are electrically connected. The second depression and the second redistribution layer extends from the lower surface toward the upper surface and is in connection with the first depression through a connection portion. The second redistribution layer is electrically connected to the first redistribution layer through the connection portion. The packaging layer is disposed on the lower surface.

主权项

1. A chip package, comprising:
a semiconductor chip having at least an electronic component and at least a conductive pad, the conductive pad and the electronic component being electrically connected and disposed on an upper surface of the semiconductor chip; a first depression recessing from the upper surface toward a lower surface of the semiconductor chip; a first redistribution layer extending from the upper surface toward the lower surface, wherein the first redistribution layer and the conductive pad are electrically connected and a portion of the first redistribution layer is disposed in the first depression; a first passivation layer overfilling the first depression and covering the first redistribution layer and the upper surface; a second depression recessing from the lower surface toward the upper surface into the first passivation layer; a second redistribution layer extending from the lower surface to an overlapping region between the first depression and the second depression and terminating the first redistribution layer; and a packaging layer disposed on the lower surface.