SEMICONDUCTOR MODULE AND METHOD FOR DESIGNING THE SAME

摘要

PROBLEM TO BE SOLVED: To shorten the length of a surface layer wiring.SOLUTION: A semiconductor module comprises: a semiconductor chip D1F mounted on a first surface layer 20F of a module substrate 20 and including a signal input terminal 31; a semiconductor chip D1B mounted on a second surface layer 20B of the module substrate 20 and including a signal input terminal 32; a stub TL2_1 which is provided in the first surface layer 20F and whose one end is connected to the signal input terminal 31; a stub TL2_2 which is provided in the second surface layer 20B and whose one end is connected to the input signal terminal 32; at least one stub TL1_2 provided in an inner layer of the module substrate 20; a through hole conductor TH1 for connecting the stub TL1_2 and the other end of the stub TL2_1; and a through hole conductor TH2 for connecting the stub TL1_2 and other end of the stub TL2_2. According to the present invention, the length of the surface layer wiring can be shortened even when the semiconductor module is used as a first rank product.SELECTED DRAWING: Figure 6