ETCH SELECTIVITY ENHANCEMENT, DEPOSITION QUALITY EVALUATION, STRUCTURAL MODIFICATION AND THREE-DIMENSIONAL IMAGING USING ELECTRON BEAM ACTIVATED CHEMICAL ETCH

摘要

Etch selectivity enhancement during electron beam activated chemical etch (EBACE), methods and apparatus for evaluating the quality of structures on an integrated circuit wafer using EBACE, a method for modifying a surface of a substrate (or a portion there of), methods and apparatus for imaging a structure and an associated processor-readable medium are disclosed. A target or portion thereof may be exposed to a gas composition of a type that etches the target when the gas composition and/or target are exposed to an electron beam. By directing an electron beam toward the target in the vicinity of the gas composition, an interaction between the electron beam and the gas composition etches a portion of the target exposed to both the gas composition and the electron beam.