发明名称 |
APPARATUS FOR DETECTING X-RAYS |
摘要 |
An apparatus for detecting X-rays and converting the detected X-ray intensities into digital signals is disclosed. The apparatus places Analog to Digital Conversion (ADC) chips directly under a scintillator array along the X-ray beam direction and uses a shield that is placed between a photodiode substrate and an Analog to Digital Conversion (ADC) chip to block X-rays from directly reaching the dies of the ADC chips, which are sensitive to X-rays. Also an X-ray CT system utilizing the disclosed apparatus for detecting X-rays is provided. |
申请公布号 |
US2016320495(A1) |
申请公布日期 |
2016.11.03 |
申请号 |
US201514700178 |
申请日期 |
2015.04.30 |
申请人 |
Ying Zhengrong |
发明人 |
Ying Zhengrong |
分类号 |
G01T1/20;G01N23/04 |
主分类号 |
G01T1/20 |
代理机构 |
|
代理人 |
|
主权项 |
1. An apparatus for detecting X-rays comprising:
A. A scintillator array for receiving and converting incident X-ray photons to second energy light photons; wherein each said X-ray scintillator array is divided into individual elements organized in a matrix fashion with element rows (Z-axis for row direction) and element columns (X-axis for column direction) for detecting X-ray photons; wherein said individual scintillator elements are interspaced by gaps (areas that do not detect X-rays); wherein the X-ray photons are emitted from the positive Y-axis direction; B. A photodiode module, onto which said X-ray scintillator array is mounted along the Y-axis, for converting said second energy light photons to electric charges; C. A photodiode substrate for mounting said photodiode module along the Y-axis; D. One or more Analog to Digital Conversion (ADC) chips mounted on said photodiode substrate for converting said electric charges to digital signals; wherein said ADC chips are mounted on the opposite side of said photodiode module and directly underneath said photodiode module along the Y-axis; and, E. An X-ray shield is placed between said photodiode substrate and each of said ADC chips for blocking X-ray photons attenuated by said individual scintillator elements and X-ray photons travelled through said gaps of said scintillator array from reaching said ADC chips; wherein the number of said shields equals to the number of said ADC chips. |
地址 |
Belmont MA US |