发明名称 Polyamide resin composition for inner layer of delamination container, and delamination container obtained using same
摘要 Provided are a polyamide resin composition for inner layer of a delamination container which includes a laminate of at least two layers including an outer layer (1) composed of a thermoplastic resin (A) and an inner layer (2) composed of a polyamide resin composition and capable of being delaminated from the outer layer (1) to perform volume reduction deformation and in which an outside air introduction hole for introducing the outside air into between the outer layer (1) and the inner layer (2) is formed in the outer layer (1), the polyamide resin composition containing specified polyamide resin (a) and polyamide resin (b), having a tensile modulus of elasticity of 2,000 MPa or less at a temperature of 23°C. and a humidity of 50% RH, and having a content of the polyamide resin (a) in the polyamide resin composition of 20 to 75% by mass; and a delamination container using the same as an inner layer.
申请公布号 US9487655(B2) 申请公布日期 2016.11.08
申请号 US201414772062 申请日期 2014.03.13
申请人 MITSUBISHI GAS CHEMICAL COMPANY, INC. 发明人 Ishii Kentaro;Kato Tomonori;Oda Takafumi
分类号 B29C49/00;B65D1/02;C08L77/02;C08L77/06;B65D65/40;B32B27/34;B32B27/08;B32B27/30;B32B27/32;B32B27/36;B65D83/00;B29K77/00;B29K101/12;B29L31/00 主分类号 B29C49/00
代理机构 Fitch, Even, Tabin & Flannery LLP 代理人 Fitch, Even, Tabin & Flannery LLP
主权项 1. A delamination container which comprises a laminate of at least two layers including an outer layer (1) composed of a thermoplastic resin (A) and an inner layer (2) composed of a polyamide resin composition and capable of being delaminated from the outer layer (1) to perform volume reduction deformation and in which an outside air introduction hole for introducing the outside air into between the outer layer (1) and the inner layer (2) is formed in the outer layer (1), wherein the polyamide resin composition comprises: a polyamide resin (a) constituted of a diamine component including 70 mol % or more of m-xylylenediamine and a dicarboxylicg acid component including 70 mol % or more of a linear aliphatic dicarboxylicg acid having 6 to 18 carbon atoms; and a polyamide resin (b) constituted of a linear aliphatic component having 6 to 18 carbon atoms, the polyamide resin composition has a tensile modulus of elasticity of 2,000 MPa or less at a temperature of 23° C. and a humidity of 50% RH, and having a content of the polyamide resin (a) in the polyamide resin composition of 20 to 75% by mass.
地址 Tokyo JP