发明名称 |
Printhead die with multiple termination rings |
摘要 |
A printhead die includes a SiO2 layer grown into a surface of a silicon substrate, and a dielectric layer deposited onto an interior surface area of a substrate. Multiple termination rings are formed around the interior surface area. Each ring is defined by an absence of the dielectric layer. A berm is located in between each termination ring. Each berm is defined by the presence of the dielectric layer. |
申请公布号 |
US9498953(B2) |
申请公布日期 |
2016.11.22 |
申请号 |
US201314762958 |
申请日期 |
2013.01.23 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
Fuller Anthony M.;Rivas Rio;Jensen Kellie Susanne |
分类号 |
B41J2/135;B41J2/14;C23C28/00 |
主分类号 |
B41J2/135 |
代理机构 |
HP Inc—Patent Department |
代理人 |
HP Inc—Patent Department |
主权项 |
1. A printhead die comprising:
a SiO2 layer grown into a surface of a silicon substrate; a dielectric layer formed on the surface over an interior area of the substrate; a first termination ring surrounding the interior area and defined by an absence of the dielectric layer; a berm surrounding the first termination ring and defined by the presence of the dielectric layer; and a second termination ring surrounding the berm and defined by an absence of the dielectric layer. |
地址 |
Houston TX US |