发明名称 Printhead die with multiple termination rings
摘要 A printhead die includes a SiO2 layer grown into a surface of a silicon substrate, and a dielectric layer deposited onto an interior surface area of a substrate. Multiple termination rings are formed around the interior surface area. Each ring is defined by an absence of the dielectric layer. A berm is located in between each termination ring. Each berm is defined by the presence of the dielectric layer.
申请公布号 US9498953(B2) 申请公布日期 2016.11.22
申请号 US201314762958 申请日期 2013.01.23
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 Fuller Anthony M.;Rivas Rio;Jensen Kellie Susanne
分类号 B41J2/135;B41J2/14;C23C28/00 主分类号 B41J2/135
代理机构 HP Inc—Patent Department 代理人 HP Inc—Patent Department
主权项 1. A printhead die comprising: a SiO2 layer grown into a surface of a silicon substrate; a dielectric layer formed on the surface over an interior area of the substrate; a first termination ring surrounding the interior area and defined by an absence of the dielectric layer; a berm surrounding the first termination ring and defined by the presence of the dielectric layer; and a second termination ring surrounding the berm and defined by an absence of the dielectric layer.
地址 Houston TX US