Methods for forming apparatus for stud bump formation

摘要

An apparatus used for forming stud bumps may be formed by providing a first clamp plate comprising a clamping surface, forming a notcher on the clamping surface, and forming a contact stopper on the clamping surface. The apparatus may include a clamp that includes at least two opposing plates, and at least one of the opposing plates includes a protruding feature that intersects the wire when the wire is clamped forming a first notch in the wire. The method for forming stud bumps includes bonding wire to a bonding surface, releasing the wire from the clamp, passing the wire a notch pitch distance through the clamp, clamping the wire with the clamp forming a second notch in the wire, and breaking the wire leaving a bonded portion of the wire on the bonding surface.

主权项

1. A method, comprising:
providing a clamp comprising a first clamp plate comprising a clamping surface; providing a rod; forming a notcher on the clamping surface, the forming comprising welding the rod to the clamping surface, the notcher configured to form a notch in a wire; forming a first contact stopper on the clamping surface; and connecting a wire guide to the clamp, the wire guide comprising a cylindrical opening, an axis of the cylindrical opening extending through an opening of the clamp.