| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board which realizes streamlining of the manufacturing process and manufacturing cost reduction and enables thickness reduction, and to provide a manufacturing method of the printed wiring board.SOLUTION: A printed wiring board 1 includes: a first conductive layer 21; a first insulation layer 31 laminated on the first conductive layer 21; and a second conductive layer 22 laminated on the first insulation layer 31 on at least the one surface side of a base material 10. The second conductive layer 22 is laminated on the first insulation layer 31 through a foundation layer 40 formed by a layer including metal particles. |
