| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an LED package capable of increasing a light extraction efficiency on a surface of a translucent resin part such as a molding resin or lens. <P>SOLUTION: After mounting an LED chip 105, the LED chip 105 is sealed by a molding resin 107 (stage S1). As the molding resin 107, for example, a silicon resin can be used. Thereafter, the molding resin 107 for sealing the LED chip 105 is cured (stage S2). Thereafter, roughness is formed on the surface of the molding resin 107 by using a laser abrasion step (stage S3). <P>COPYRIGHT: (C)2007,JPO&INPIT |
