| 发明名称 |
METHOD FOR MANUFACTURING GALVANOPLASTIC PRODUCTS, IN PARTICULAR THIN COPPER FOIL FOR PRINTED CIRCUIT CARDS |
| 摘要 |
A method for manufacturing the galvanoplastic products, in particular the thin copper foil for the printed circuit cards comprises the plasmachemical coating of the cathodic base with titanium nitride layer, 0.1-1.0 mm in thickness followed by electric precipitation of the metal layer.
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| 申请公布号 |
UA80289(C2) |
申请公布日期 |
2007.09.10 |
| 申请号 |
UA20050001466 |
申请日期 |
2005.02.17 |
| 申请人 |
DNIPROPETROVSK NATIONAL UNIVERSITY |
发明人 |
TROTSENKO VLADYSLAV IVANOVYCH;DRON'' MYKOLA MYKHAILOVYCH;ROZMOLOHOV VALERII LEONIDOVYCH |
| 分类号 |
C25D1/00;C25D1/04;C25D3/38 |
主分类号 |
C25D1/00 |
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