发明名称 Infrared sensor package
摘要 A dual-band infrared sensor package for use in radar system applications is provided. The package includes two detector arrays, an InSb photodiode array sensitive in the mid-wave infrared radiation range and a HgCdTe photodiode array sensitive in the long-wave infrared radiation range. The package further includes integrated circuits which provide electrical control to and data output from the detector arrays. A three dimensional arrangement of the detector arrays, integrated circuits, and ceramic interconnecting substrates is used to provide a relatively small sensor package suitable for radar system applications so that radar signals are not obscured.
申请公布号 US5391875(A) 申请公布日期 1995.02.21
申请号 US19900555867 申请日期 1990.07.18
申请人 RAYTHEON COMPANY 发明人 CEDERBERG, ANDREW A.;LITCHFIELD, WILLARD C.
分类号 G01J5/00;H04N5/33;(IPC1-7):G01J5/04;G01J5/08 主分类号 G01J5/00
代理机构 代理人
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