Method of manufacturing a bonded, aluminum containing device

摘要

An aluminum-containing material is bonded to a substrate which has a bondable metallic coating comprising a lower nickel (alloy) layer, an intermediate palladium (alloy) layer and an upper gold (alloy) layer. Independent claims are also included for the following: (i) a bonded aluminum material-containing device produced by the above method; and (ii) use of a substrate having a bondable metallic coating as described above for bonding an aluminum-containing material, especially aluminum wire. Preferred Features: The nickel alloy is a nickel-boron, nickel-phosphorus, nickel-iron-phosphorus, nickel-phosphorus-tungsten, nickel-cobalt-phosphorus or nickel-tungsten alloy. The palladium-containing layer consists of a palladium layer, a palladium/10-40 wt.% nickel alloy layer or a palladium/10-50 wt.% silver alloy layer with an underlying palladium bond layer. The gold alloy is a gold-iron, gold-cobalt or gold-nickel alloy layer. The substrate may consist of copper, nickel or their alloys or may comprise a metal/plastic composite material.