| 摘要 |
An apparatus for providing liquid cooling to high power high capacity, switching, transport and processing equipment is disclosed. The electronics of such equipment is typically contained in metal electronics modules, with the heat being directed to the walls of the modules. A pair of cooling plates with integral coolant flow through is pressed against the metal module walls with pressure. The cooling plates remain part of the shelf and the metal electronics modules can be removed for repair, exchange or upgrade.
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