PRESSURE-CONTACTABLE POWER SEMICONDUCTOR MODULE

摘要

Pressure contact power semiconductor module comprises: base (1) and cover (2) plates; a semiconductor module (3) with first (31) and second connections (32); and a spring (4) arranged between the first connection and the cover plate. The lower connection connects the semiconductor module to the base plate, while the electrical connection to be cover plate is made via a contact strut (5) that extends through the center of the spring.