| 摘要 |
PROBLEM TO BE SOLVED: To provide a film winding device and a winding method for smoothly winding a film, which is cut in a predetermined form and whose edge is getting thinner, preventing wrinkles in the film, and adhering a film such as a masking tape on a semiconductor wafer, on a body to be attached without waste. SOLUTION: Bypass means separate a rolled web A, which is formed by temporally attaching a band-like film A2 to a band-like peeling sheet A1, into the peeling sheet A1 and the film A2 once, and rejoin them. The separated film A2 separated by the bypass means is attached to the body B to be attached, and the adhered film A2 is cut into a predetermined form, and then the peeling sheet A1 separated by the bypass means is adhered to cover the cutout hole of the film A2 before the cut film A2 and the peeling sheet A1 is wound up together at the same time. COPYRIGHT: (C)2007,JPO&INPIT
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