White light emitting diode, manufacturing method and packaging material thereof

摘要

A white light emitting diode comprising a substrate layer, two conductive frames, a light emitting unit, two conductive wires, and a packaging element is provided. The substrate layer is made from a curing reaction of first mixture, and the first mixture includes a curable resin, a curing agent, a phosphor material, and a modified thermal conductive nano-material, wherein the modified thermal conductive nano-material is made from a thermal conductive nano-material and a silane compound. The packaging element is made from a curing reaction of second mixture, and the second mixture includes a curable resin, a curing agent, a phosphor material, and a modified thermal conductive nano-material, wherein the modified thermal conductive nano-material is made from a thermal conductive nano-material and a silane compound. The chip-type white light emitting diode has a good heat-dissipating effect and a good luminous efficiency without additional heat dissipation fins. In addition, the manufacturing method of the chip-type white light emitting diode is a relatively simple process for mass production.

主权项

1. A white light emitting diode, comprising:
a substrate layer, being made from a curing reaction of a first mixture, and the first mixture includes a curable resin, a curing agent, a phosphor material, and a modified thermal conductive nano-material, wherein the modified thermal conductive nano-material being made from a thermal conductive nano-material and a silane compound; two conductive frames, each conductive frame having an end portion connected with the substrate layer; a light emitting unit, disposed on a surface of the substrate layer; two conductive wires, connecting to the light emitting unit respectively, and each conductive wire connecting to the corresponding conductive frame; and a packaging element, covering the conductive wires and the light emitting unit, and the packaging element being made from a curing reaction of a second mixture, and the second mixture includes a curable resin, a curing agent, a phosphor material, and a modified thermal conductive nano-material, wherein the modified thermal conductive nano-material being made from a thermal conductive nano-material and a silane compound.