发明名称 RADIATION DETECTION APPARATUS, MANUFACTURING METHOD THEREFOR, AND RADIATION DETECTION SYSTEM
摘要 A method of manufacturing a radiation detection apparatus is provided. The method includes preparing a sensor panel having first and second opposing surfaces with a pixel array and electrical contacts being arranged on the first surface side, and adhering a first supporting portion to the panel with an adhesive layer. The first supporting portion supports the pixel array from the second surface side of the panel. The method further includes fixing a second supporting portion to the panel so as to inhibit the second supporting portion from being removed from the panel. The second supporting portion supports the electrical contacts from the second surface side of the panel. The method further includes pressure-bonding wiring members to the electrical contacts. In the pressure-bonding, the elastic modulus of the second supporting portion is higher than that of the adhesive layer.
申请公布号 US2016181308(A1) 申请公布日期 2016.06.23
申请号 US201615053045 申请日期 2016.02.25
申请人 CANON KABUSHIKI KAISHA 发明人 Ichimura Tomoaki;Okada Satoshi;Nagano Kazumi
分类号 H01L27/146;A61B6/00 主分类号 H01L27/146
代理机构 代理人
主权项 1. A method of manufacturing a radiation detection apparatus, the method comprising: preparing a sensor panel having a first surface and a second surface located on an opposite side to the first surface, with a pixel array and electrical contacts being arranged on the first surface side; adhering a first supporting portion to the sensor panel with an adhesive layer, the first supporting portion supporting the pixel array from the second surface side of the sensor panel; fixing a second supporting portion to the sensor panel so as to inhibit the second supporting portion from being removed from the sensor panel, the second supporting portion supporting the electrical contacts from the second surface side of the sensor panel; and pressure-bonding wiring members to the electrical contacts, wherein an elastic modulus of the second supporting portion in the pressure-bonding is higher than an elastic modulus of the adhesive layer in the pressure-bonding.
地址 Tokyo JP