SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS

摘要

A solid-state imaging device includes an Si substrate in which a photoelectric conversion unit that photoelectrically converts visible light incident from a back surface side is formed, and a lower substrate provided under the Si substrate and configured to photoelectrically convert infrared light incident from the back surface side.

主权项

1. A method of manufacturing an imaging device, the method comprising:
forming, by a manufacturing device, a photoelectric conversion unit that photoelectrically converts visible light incident from a back surface side, in a Si substrate; and affixing, by a manufacturing device, a lower substrate that photoelectrically converts infrared light incident from the back surface side, under the Si substrate.